2014 ACE KISS 101 Lead-Free Selective Soldering

Description

KISS-101 Standard Features:
– “Super Quick” motion for fastest processing times
– Will completely process PCBs 12” x 12” (300mm x 300mm) and up to 24” long PCBs (600mm) using a manual step over
– Universal PCB location rails with multiple PCB positions
– Automated Fiducial Correction
– Board Warp Compensation
– Windows 7 OS with SWAK-OS programming interface with rapid setup time to “first production” using the machine “teach” functions
– Step and repeat capability in both X- and Y-axis for multiple boards in a panel
– Lead alloy solder pot and pump assembly included—lead- free alloy (all titanium) and HMP alloy pot and pump available
– Programmable solder wave flow rate
– Programmable solder pot timer
– 6mm and 12mm Bullet nozzles
– Heated nitrogen to the solder nozzle
– Precision KFS-SP atomizing flux applicator
– Set the time/temp profile for each individual component type for maximized process control and TAKT time
– Absolute control over all critical process parameters:
-Solder temperature interlocked to within 10°C – Height and travel speed of the solder wave
– Programmable initial preheat soak time

Motion:
– Z-Axis Accuracy/Repeatability +/-.002″
Speed 0-3 inches/sec.
X- and Y-Axis Accuracy/Repeatability +/-.002″
Speed 0-4” inches/sec.
Solder Pot:
– Temperature PID proportioning (0-400°C) ± 2°C
– Solder Capacity 30 lbs. (14 kilos)
– Pump PC controlled
Software:
– Windows 7 OS and SWAK-OS programming interface
Physical:
– Dimensions 54″ wide x 40″ deep x 45″ high (1371mm wide x 1016mm deep x 1143mm high)
– Weight (dry) 650 lbs.(295 kilos)