ACE KISS 102IL Selective Solder Machine

Description

Demo Unit – Low Hours

Windows 7 O/S

SWAK programming interface

Standard Features:

• SMEMA edge conveyor with program controlled width adjustment, positive PCB location and PCB flattening
• “Super Quick” motion for fastest processing times
• Windows 7 O/S with the interactive SWAK on machine programming interface (see the SWAK data sheet and video) Rapid setup and time to “first production”, usually within 10 minutes
• Automated Fiducial Correction
• Dual monitors (great for simultaneous video feed from cameras)
• Step and repeat capability in both X and Y axis for multiple boards in a panel
• Lead alloy solder pot and pump assembly included—lead free alloy (all titanium) and HMP alloy pot and pump available
• Full set of 7 “Bullet Nozzles”
• Heated Nitrogen to the solder nozzle
• Programmable flux deposition
• Programmable solder wave flow rate
• Programmable Solder Pot Timer
• Automated in process solder wave height check / adjust
• Automated solder pot level check and fill
• Two (2) process witness cameras
• Precision KFS-SP atomizing flux applicator
• Offline programming software
• Set the time/temp profile for each individual component type for maximized process control and TAKT time
• Absolute control over all critical process parameters:
  • Solder temperature interlocked to within 2 degrees C
  • Height and travel speed of the solder wave
  • Programmable initial pre-heat soak time

PCB Panel Size:

• Minimum: 2” x 2” (50mm x 50mm)
• Maximum: 16” x 16” (400mm x 400mm)

Motion:

• Z-Axis Accuracy/Repeatability +/-.002″ Speed 0-3 inches/sec
• X and Y Axis Accuracy/Repeatability +/-.002″ Speed 0-4 inches/sec

Solder Pot:

• Temperature PID proportioning (0-400°C) ± 2°C
• Solder Capacity 30 lbs. (14 kilos)
• Pump PC controlled

Physical:

• Dimensions 54″ wide x 57″ deep x 54″ high (1371mm wide x 1447mm deep x 1371mm high)
• Weight (dry) 900 lbs. (409 kilos)