ACE KISS-103 Selective Soldering Machine (Lead-Free) For Sale

Description

PCB Panel Size
– Minimum: 2” x 2” (50mm x 50mm)
– Maximum: 24” x 18” (600mm x 450mm) (up to 48” long PCBs with manual step over)
– Safe “Keep Away” (distance to adjacent pads) 1mm

Motion
– Z-Axis Accuracy/Repeatability: +/-.002″ / Speed 0-3 inches/sec
– X and Y Axis Accuracy/Repeatability: +/-.002″ / Speed 0-4 inches/sec

Solder Pot
– Temperature: PID proportioning (0-400°C) ± 2°C
– Solder Capacity: 30 lbs. (14 kilos)
– Pump: PC controlled

Software
– Windows 7 O/S and SWAK programming interface

Physical
– Dimensions: 58″W x 57″D x 54″H (1473mm x 1447mm x 1371mm)
– Weight: 930 lbs. (422 kg)

Facilities
– Power: 120VAC/1 Ph/60 Hz 15 amps
– Air 90 (minimum) to 100 (maximum) PSI
– Nitrogen 99.999% pure, 30-50 CFH @ 60 (minimum) to 100 (maximum) PSI
– Exhaust 250 CFM recommended

Standard Features:
– “Super Quick” motion for fastest processing times
– Will Process PCBs 24” x 18” (600mm x 450mm) unassisted (flux and solder) and up to 48” long PCBs with manual step over
– Universal PCB location rails with motor driven adjustment and multiple board stops for processing several boards together
– Interactive SWAK on machine programming interface
– Rapid setup and time to “first production”, usually within 10 minutes
– Automated Fiducial Correction
– Step and repeat capability in both X and Y axis for multiple boards in a panel
– Lead alloy solder pot and pump assembly included—lead free alloy (all titanium) and HMP alloy pot and pump available
– 6mm and 12mm “Bullet” nozzles
– Programmable solder wave flow rate
– Process witness camera
– Automated in process solder wave height check / adjust.
– Automated solder pot level check and fill
– Heated Nitrogen to the solder nozzle
– Precision KFS-SP atomizing flux applicator
– Set the time/temp profile for each individual component type for maximized process control and TAKT time
– Absolute control over all critical process parameters:
– Solder temperature interlocked to within 10°C
– Height, and travel speed of the solder wave
– Programmable initial pre-heat soak time