(864) 249-0943
(864) 249-0943
Lot #L7065
Standard Machine features and system description:
Ultra-fine pitch and small ball bonding capabilities
High frequency transducer operating at 138 kHz
Applicable wire size of 0.6mil-2.0mil
High speed XY table with linear motor technology
High accuracy workholder with linear indexer
Multiple magazine input / output elevator system for magazines
Light weight voice-coil wire clamp assembly
Strong window clamp force
CCD camera with RR-mode capability and dual magnification optics
Individual target point programmable coaxial and ring LED lighting system
Built-in Inline Vision inspection system
Real time monitoring of bonding parameters bond force, bond power and position
Intelligent looping control incorporates auto tuning technology for loop trajectory profiling
Loop profiles to cover low loop, square loop, normal reverse, ground and J-wire looping
Enhanced EFO and non-stick detection control
Real time monitoring of FAB
Post-bond monitoring module (post bond inspection and statistical management system)
Menu and graphics driven man-machine interface
Combined hard disk and USB port for data and program storage
Features:
• High speed and high resolution
• X-power dual directional transducer
• Precision ball size formation
• Easy loop programming feature (ECP)
• Copper bonding capable
• Real time monitoring features
• Full traceability logging
• Automatic magazine changing system
• Quick product changeover
• Low maintenance requirements
• Easy to change heat block and window clamp
Wire Bonding Capabilities:
Wire Type: Au, Cu, Ag
Wire Size: 0.5 – 2.0 mil
Speed: Up to 24 wires/sec
Accuracy: ±3.0 um @ 3 σ
Material Handling Capabilities:
True Bonding Area 56 – 90 mm
Leadframe Length 140 – 300 mm
Width <= 100 mm
Thickness 0.1 – 0.8 mm
Magazine Length 140 – 305 mm
Width 32 – 115 mm
Height <= 180 mm
Machine Details:
Width 1,200 mm
Depth 900 mm
Height 1,760 mm
Weight 800 kg
Power:
1200 W VOLTAGE 220 VAC
CYCLES 50/60 Hz
AIR PRESSURE 5 BAR, 150 LPM
*** Spare Parts Kit included ***
