CyberOptics SE 300 Ultra 3D SPI

Description

Solder Paste Inspection

Max. Panel Size: 508mm x 508mm (20″ x 20″)

Min. Panel Size: 101mm x 40mm (4″ x 1.5″)

Board Thickness: 0.5mm to 5mm (0.02″ to 0.2″)

Top Board Edge Clearance: 2.5mm (0.1″)

Bottom Board Edge Clearance: 3mm (0.12″)

Laser Range Finder 640-870 nm, 1mW max, Class II

Maximum Inspection Area: 508mm x 503mm (20″ x 19.5″)

Typical Inspection Speeds

High speed 29.0 sq. cm/sec (4.5 sq. in./sec)

High resolution 16.0 sq. cm/sec (2.5 sq. in./sec)

Unload and fiducial find 3-4 seconds

X and Y Pixel Size

High speed 40 microns (1.6 mils)

High resolution 20 microns (0.79 mils)

Field of View: 10 x 20 mm (0.39 x 0.79 in.)

Paste Height Range 50-350 microns (2-14 mils)

With Optional Sensor 50-610 microns (2-24 mils)

Dimensions (h x w x d) 200cm H x 98cm W x 125cm D

Weight 860 kg (1900 lbs.)