CyberOptics SE350 3D SPI – Solder Paste Inspection

Description

CyberOptics SE350-L 3D SPI
3-D Solder Paste Inspection Machine
Model: SE350-L
Vintage: 2010
OS: Windows XP
Calibration Kit & Manuals Included
Calibration-Free Sensor Technology
Integrated SE500 Sensor Assembly
Inspecs Pad Sizes Down To 01005
Max Panel Size: 20″ X 20″
Min Panel Size: 2″ X 2″
Board Thickness: .3mm to 5.0mm (0.01 to 0.2 in)
Interface: SMEMA, RS232, and Ethernet
Weight: 1, 433 lbs
Footprint/Dimensions: 100x127x139 cm