Yamaha i-PULSE M10 High-Speed Pick & Place

Description

High-Speed Pick & Place Machine

Board size (with buffer unused): Min. L50 x W30mm to Max. L980 x W510mm *1
Board size (with input or output buffer used): Min. L50 x W30mm to Max. L420 x W510mm
Board size (with input and output buffers used): Min. L50 x W30mm to Max. L330 x W510mm
Board thickness: 0.4 – 4.8mm
Board flow direction: Left to right (Standard)
Board transfer speed: Max 900mm/sec
Placement speed (4 heads + 1 theta): 0.15sec/CHIP (24,000CPH)
Placement speed (4 heads + 4 theta): 0.15sec/CHIP (24,000CPH)
Placement speed (6 heads + 2 theta): 0.12sec/CHIP (30,000CPH)*2
Placement speed (4 heads + 1 theta): 19,000CPH
Placement speed (4 heads + 4 theta): 19,000CPH
Placement speed (6 heads + 2 theta): 23,000CPH*2
Placement accuracy A: CHIP +/-0.040mm
Placement accuracy B: IC +/-0.025mm
Placement angle: +/-180 degrees
Z axis control: AC servo motor
Theta axis control: AC servo motor
Component height: Max 30mm*3 (Pre-placed components: max 25mm)
Applicable components: 0402 to 120x90mm, BGA, CSP, connector, etc.
Component package: 8 – 56mm tape (F1/F2 Feeders), 8 – 88mm tape (F3 Electric Feeders), stick, tray
Drawback check: Vacuum check and vision check
Board positioning: Board grip unit, front reference, auto conveyor width adjustment
Component types: Max 72 types (8mm tape), 36 lanes x 2
Transfer height: 900 +/- 20mm