YESTech YTV-FX In-line AOI

Description

Multi-function system with top-down viewing, 5 megapixel camera

Specifications
Throughput: Up to 10 sq. in./sec. > 500,000 components per hour
Maximum Board Size: 22” x 20” (560mm x 510mm)
Clearance: 2” (50mm) top and bottom
Minimum Component Size: 0201; 01005 with high magnification option
False Calls: <500 PPM (<0.05% typical)
Defects Detected: Part: position, missing, wrong, polarity, skew, tombstone
Lead: bent, lifted, bridging
Solder: open, insufficient, short, solder balls

Software
Algorithms: Color, OCV, OCR, barcode recognition, both image and rule-based algorithms
Data Requirements: ASCII Text, X-Y position, part #, ref. #, polarity
CAD Translation Package: Aegis, Unicam, Fabmaster, YESTECH CAD Utility
Programming Skill Level: Technician or operator
Operating System: Windows XP Professional
Off-line Software: Optional – Rework, Review and Program Creation
SPC Software: Optional – Real-time local and remote monitoring of first pass yield, defect trends, and machine utilization.
Data Outputs: Text, SQL, ODBC, MS Access

Hardware
Material Handling: SMEMA, dual direction auto width conveyor, pass / fail signals, board clamping
Lighting: Proprietary Fusion Lighting™ multiangle LED
Imager: 5 megapixel color camera
Resolution 2448 x 2048; 25, 12 or 8 micron pixel size

Facilities
Power: 110VAC (220 optional) 50/60 Hz, 15 amps
Air input: 30 PSI min., 1/4 air hose, 2 CFM
Footprint: 55” x 57” x 50” (1400mm x 1450mm x 1270mm)
Weight: 1,850 lbs