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Equipment Specs PDF

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Manufacturer

CyberOptics

Model

SE300 Ultra

Lot Number

L4857

Notes

Solder Paste Inspection

Max. Panel Size: 508mm x 508mm (20" x 20")

Min. Panel Size: 101mm x 40mm (4" x 1.5")

Board Thickness: 0.5mm to 5mm (0.02" to 0.2")

Top Board Edge Clearance: 2.5mm (0.1")

Bottom Board Edge Clearance: 3mm (0.12")

Laser Range Finder 640-870 nm, 1mW max, Class II

Maximum Inspection Area: 508mm x 503mm (20" x 19.5")

Typical Inspection Speeds

High speed 29.0 sq. cm/sec (4.5 sq. in./sec)

High resolution 16.0 sq. cm/sec (2.5 sq. in./sec)

Unload and fiducial find 3-4 seconds

X and Y Pixel Size

High speed 40 microns (1.6 mils)

High resolution 20 microns (0.79 mils)

Field of View: 10 x 20 mm (0.39 x 0.79 in.)

Paste Height Range 50-350 microns (2-14 mils)

With Optional Sensor 50-610 microns (2-24 mils)

Dimensions (h x w x d) 200cm H x 98cm W x 125cm D

Weight 860 kg (1900 lbs.)

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